LAIRD TPLI2200
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 5.08 mm Large-Gap Pad
- A0 Adhesive-Free Surface
- 6.0 W/m-K Insulating Interface
Product Description
Tpli 2200 A0 Thermal Gap Filler is a 5.08 mm boron-nitride-filled silicone sheet for large electronic thermal gaps. The A0 configuration is supplied without adhesive, allowing direct placement where added tack is not required. Its soft, compliant construction combines 6.0 W/(m K) thermal conductivity with electrical insulation and an operating range of -45 to 200 deg C. The 8 x 8 inch sheet format can be converted into application-specific parts for component-to-hardware interfaces. Applications include automotive electronics, telecom and datacom equipment, routers, gaming systems, instrumentation, portable devices, wireless infrastructure, and other assemblies requiring a thick compressible thermal pad.
Key features
- 5.08 mm Large-Gap Pad: The Tpli 2200 configuration fills large component-to-hardware gaps.
- A0 Adhesive-Free Surface: The 8 x 8 inch sheet is supplied without adhesive for direct placement.
- 6.0 W/(m K) Insulating Interface: Boron-nitride-filled silicone combines thermal transfer with electrical insulation.
Applications / Suitable for
- Automotive electronics and powertrain ECUs
- Telecom, datacom, and wireless infrastructure
- Routers, gaming systems, and instrumentation
- Notebooks, tablets, and portable devices
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Supplied A10112-01 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Boron-nitride-filled silicone sheet | Tpli 200 series | |
| Color | Varies by thickness | Visual | |
| Nominal thickness | 5.08 | mm | 0.200 inch; Tpli 2200 |
| Sheet size | 8 x 8 | inches | A10112-01 configuration |
| Adhesive option | A0 - none | No adhesive | |
| Density | 1.4 | g/cc | Helium pycnometer |
| Hardness | 70 | Shore 00 | ASTM D2240 |
| Shelf life | 2 | years from shipment | A0 configuration without adhesive |
After-processing / final-state properties
Typical in-service properties for the Tpli 200 material used in Tpli 2200 A0.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 6.0 | W/(m K) | ASTM D5470 |
| Operating temperature range | -45 to 200 | deg C | Specified operating range |
| Dielectric constant | 3.2 | 10 GHz; ASTM D150 | |
| Volume resistivity | 5 x 10^13 | ohm cm | ASTM D257 |
| Outgassing TML / CVCM | 0.46 / 0.15 | % | ASTM E595 |
| Flammability | HB | UL 94 |
