HUMISEAL 1B51NS-60
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- Low Moisture-Vapor Transmission
- Rapid Synthetic-Rubber Handling
- Flexible Low-Stress Protection
Product Description
HumiSeal 1B51NS-60 Synthetic Rubber Conformal Coating is a fast-drying single-component synthetic rubber conformal coating for printed circuit assemblies. The liquid has a density of 0.81 +/- 0.02 g/cm^3, 22 +/- 1.5% solids, and a viscosity of 185 +/- 30 cP. It dries to handle in 10 minutes and is applied at a recommended thickness of 25 to 75 um. The cured film is flexible, low stress, repairable, and has very low moisture-vapor permeability. Cure is completed in 24 hours at room temperature or 30 minutes at 76 deg C.
Key features
- Low moisture-vapor permeability: The synthetic rubber film has documented moisture-vapor transmission below 1 g/(m^2 day mil).
- Ten-minute dry-to-handle time: The coating reaches the documented handling stage in 10 minutes.
- Flexible low-stress film: The cured coating is flexible, low stress, and repairable.
Applications
- Conformal coating of printed circuit assemblies
- Moisture and environmental protection of electronic assemblies
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Density (g)
0.81 g/cm3
Solids
22 %
Thickness range
0.025-0.075 mm
Physical Properties
Viscosity
850 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
VOC
632 grams/liters
Electrical Properties
Breakdown Voltage
4900 V
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that conducts electricity at some proportion of the total current.
After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.
This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.
Thermal Properties
Glass Transition Temperature (Tg)
14 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical liquid, handling, and shelf-life data before application.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Density | 0.81 +/- 0.02 | g/cm^3 | ASTM D1475 |
| Solids content | 22 +/- 1.5 | % by weight | Fed-Std-141 method 4044 |
| Viscosity | 185 +/- 30 | cP | Fed-Std-141 method 4287 |
| VOC | 632 | g/L | As supplied |
| Drying time to handle | 10 | min | Fed-Std-141 method 4061 |
| Shelf life at room temperature | 18 | months | From date of manufacture |
Technical properties
After-processing / final-state properties
Typical cured-film, environmental, and electrical properties after the stated cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended coating thickness | 25 to 75 | um | Applied conformal coating |
| Recommended cure | 24 h at room temperature or 30 min at 76 deg C | - | Cure schedule |
| Time to optimum properties | 7 | days | After application |
| Thermal shock | -65 to 125 | deg C | 50 cycles per MIL-I-46058C |
| Glass transition temperature | 14 | deg C | DSC |
| Coefficient of thermal expansion | 55 | ppm/deg C | TMA |
| Moisture-vapor transmission | < 1 | g/(m^2 day mil) | ASTM E398-03 |
| Dielectric withstand voltage | > 1500 | V | MIL-I-46058C |
| Dielectric breakdown voltage | 4900 | V | ASTM D149 |
| Insulation resistance | 2.0 x 10^14 | ohm | MIL-I-46058C |
| Fungus resistance | Passes | - | ASTM G21 |
