DOWSIL TC-6020

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

DOWSIL TC-6020

Main features

  • Flowable Power-Electronics Encapsulation
  • Moderate-Temperature Fast Cure
  • 2.7 W/(m K) Thermal Protection

Product Description

DOWSIL TC-6020 Thermally Conductive Encapsulant is a two-part gray silicone encapsulant for combining heat dissipation, electrical protection, and stress relief in power electronics. The 1:1 system has a typical mixed viscosity of 10,640 mPa s and a 77-minute pot life at 25 deg C, supporting manual or automated dispensing into complex assemblies. Moderate heat accelerates cure to about 23 minutes at 60 deg C or 5 minutes at 100 deg C. The cured encapsulant provides 2.7 W/(m K) bulk thermal conductivity, Shore A 63 hardness, and typical aluminum-to-aluminum lap shear strength of 0.3 MPa. Applications include on-board chargers, automotive control units, and power converters.

Key features

  • Flowable electronic encapsulation: A typical mixed viscosity of 10,640 mPa s supports manual or automated dispensing.
  • Moderate-temperature heat cure: Typical cure schedules include 23 minutes at 60 deg C and 5 minutes at 100 deg C.
  • Thermal protection performance: Cured bulk thermal conductivity is 2.7 W/(m K).

Applications / Suitable for

  • On-board chargers
  • Automotive control units
  • Power inverters and converters
Product Family

DOWSIL TC-6020

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (A / B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
77 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.926
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
20.6 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.72 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
24.1 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
8.22E+15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical mixed-system properties and processing windows before cure.

Property Value Unit Method / condition
Number of parts 2 Part A and Part B
Mix ratio 1:1 By weight
Component colors White; gray Part A; Part B
Mixed color Gray After mixing
Mixed viscosity 10,640 mPa s Typical
Pot life 77 min At 25 deg C
Heat-cure schedule 23 min At 60 deg C
Heat-cure schedule 5 min At 100 deg C
Technical properties

After-processing / final-state properties

Typical properties of the cured encapsulant; thermal conductivity is a bulk-material value.

Property Value Unit Method / condition
Density 2.93 g/cm^3 Cured material
Durometer hardness 63 Shore A Cured material
Thermal conductivity 2.7 W/(m K) Cured bulk material
Tensile strength 0.95 MPa Cured material
Elongation 20.6 % Cured material
Lap shear strength 0.3 MPa Aluminum-to-aluminum

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