DOWSIL TC-5625C

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL TC-5625C

Main features

  • One-Part Non-Curing Thermal Interface Compound
  • Thermally Conductive Thermal Interface
  • Screen, Stencil, or Dispense Application

Product Description

DOWSIL TC-5625C Thermally Conductive Compound is a one-part, greenish-yellow, flowable, non-curing silicone thermal interface compound. It supports screen printing, stencil printing, and dispensing for controlled heat-transfer interfaces. Typical bulk thermal conductivity is 2.7 W/m-K, and thermal resistance is reported as 0.09 deg C-cm2/W at 40 psi under the documented test configuration. Applications include lamps, luminaires, and circuitry cooling. Interface performance should be evaluated with bond-line thickness, pressure, surface condition, and the complete assembly in view.

Key features

  • Application fit: One-part, non-curing silicone thermal interface compound.
  • Thermal performance: Typical thermal conductivity: 2.7 W/m-K.
  • Flow and dispensing: Supports screen printing, stencil printing and dispensing.

Applications

  • Lamps
  • Luminaires
  • Circuitry cooling
Product Family

DOWSIL TC-5625C

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
4.2
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
77000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.7 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
1.89 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.3E13 Ohms⋅cm

Additional Information

THERMAL INTERFACE MATERIAL

DOWSIL TC-5625C for controlled non-curing thermal interfaces

A one-part, greenish-yellow, flowable silicone thermal compound designed for thermal-interface use without chemical cure. The technical data supports screen printing, stencil printing and dispensing, together with typical thermal conductivity and thermal resistance data that must be evaluated in their documented interface context.

One-partNon-curingFlowable2.7 W/m-K typical

AS-SUPPLIED PROPERTIES

As-supplied product characteristics

The documented product description defines the material before installation.

Property Value Condition
Product form One-part silicone thermal compound As supplied
Appearance Greenish-yellow As supplied
Rheology Flowable As supplied
Cure behavior Non-curing As supplied and installed

PROCESSING

Application methods supported by the technical record

TC-5625C is documented for screen printing, stencil printing and dispensing. Application control should focus on placing a consistent thermal-interface layer rather than treating the material as a curing adhesive.

  1. Prepare the intended thermal-interface surfaces according to the assembly process.
  2. Apply by screen printing, stencil printing or dispensing as appropriate to the assembly.
  3. Assemble the interface to the required bond-line and contact condition.

Process boundary

The material is non-curing. Thermal conductivity and thermal resistance data should not be converted into package-level cooling claims without the relevant bond-line thickness, pressure, surfaces and system test conditions.

TECHNICAL GUIDANCE

Evaluate the installed interface, not conductivity alone

TC-5625C should be assessed as a non-curing TIM whose installed behavior depends on the complete interface configuration.

Bond-line control

Use the intended application process to control the deposited layer and final interface thickness.

Pressure context

Retain the documented pressure condition when interpreting thermal-resistance data.

System evaluation

Confirm performance in the actual heat source, mating surface and assembly rather than extrapolating from bulk material data alone.

THERMAL DATA

Documented thermal-interface data

The technical data records these values as typical product data.

Property Typical value Condition / qualification
Thermal conductivity 2.7 W/m-K Typical
Thermal resistance 0.09 deg C-cm2/W At 40 psi under the documented test configuration

Thermal conductivity and thermal resistance are distinct metrics. Interface performance depends on bond-line thickness, pressure, surface condition and the complete assembly.

APPLICATIONS

Documented application context

The product uses thermal-interface use for heat dissipation from circuitry.

Lamps

Thermal-interface use in documented mid- to high-end lamp assemblies.

Luminaires

Heat-transfer interfaces in documented luminaire applications.

Circuitry cooling

General circuitry heat-dissipation interface use within the supported product scope.

Discuss your application with Krayden

For TC-5625C selection, share your interface geometry, target bond-line, assembly pressure, application method and thermal requirements so Krayden can help align the material data with the actual cooling interface. Krayden can also help review the documented processing conditions and evaluation criteria before testing.

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