DOWSIL TC-5121C
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 2.8 W/(m K) Thermal Interface
- 0.09 deg C cm^2/W Thermal Resistance
- One-Part, Non-Curing and Flowable Formulation
Product Description
DOWSIL™ TC-5121 C Thermally Conductive Compound is a one-part, flowable, non-curing silicone thermal compound designed to transfer heat between electrical devices or PCB system assemblies and a heat sink or chassis. Its filled polydimethylsiloxane formulation provides typical thermal conductivity of 2.8 W/m·K and thermal resistance of 0.09°C·cm²/W at 40 psi. The compound can form thin bondlines and may be applied by dispensing, screen printing, or stencil printing. :contentReference[oaicite:0]{index=0}
Key features
- Effective thermal transfer: Provides typical thermal conductivity of 2.8 W/m·K and low thermal resistance at a defined pressure.
- Non-curing formulation: Requires no curing oven and remains a grease-like thermal-interface compound after installation.
- Thin-bondline capability: Flowable consistency supports screen printing, stencil printing, and dispensing for controlled interface application.
Applications / Suitable for
- Thermal interfaces in mid- to high-end PCB system assemblies
- Heat transfer from electrical devices to heat sinks or chassis
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Color
Greenish Yellow
The color
Component System
One
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Specific Gravity
4.2
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Thixotropic index
1.69
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
Viscosity
79000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Thermal Conductivity
2.8 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Dielectric Strength
1.89 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
1.3E+13 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical as-supplied properties of DOWSIL TC-5121 C Thermally Conductive Compound. Values are not intended for specification purposes. :contentReference[oaicite:1]{index=1}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of components | 1 | part | As supplied |
| Composition | Filled polydimethylsiloxane | — | Product composition |
| Color | Greenish yellow | — | As supplied |
| Viscosity | 79.0 (79,000) | Pa·s (cP) | CTM 0050; temperature and shear conditions not stated |
| Thixotropy | 1.69 | — | CTM 0905 |
| Specific gravity | 4.2 | — | Uncured; CTM 0540 |
| Non-volatile content | 99.93 | % | Test method and conditions not stated |
Technical properties
After-processing / final-state properties
Typical thermal and electrical properties of the non-curing compound. Values are not intended for specification purposes. :contentReference[oaicite:2]{index=2}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.8 | W/m·K | CTM 1388; temperature and specimen conditions not stated |
| Thermal resistance | 0.09 | °C·cm²/W | At 40 psi; method and bondline thickness not stated |
| Dielectric strength | 1.89 (47.3) | kV/mm (V/mil) | CTM 0114; specimen thickness and conditioning not stated |
| Volume resistivity | 1.3 × 1013 | ohm·cm | CTM 1400 |
| Dielectric constant | 14.0 | — | At 1 kHz; CTM 1139 |
| Dissipation factor | 0.073 | — | At 1 kHz; CTM 1139 |
