DOWSIL SE 9184

Harmonization Code : 3215907090 | Ink, whether or not concentrated or solid (excl. printing ink, printer/copier ink cartridges incorporating mechanical or electrical components, and solid ink in engineered shapes for printers/copiers)

DOWSIL SE9184

Main features

  • Fast Tack-Free Rt Cure
  • Non-Sag Placement Control
  • Thermally Conductive Thermal Bonding

Product Description

DOWSIL™ SE 9184 RTV Adhesive is a one-part, non-flowing, thermally conductive RTV silicone adhesive designed to provide both adhesion and heat transfer for cooling electrical and electronic components. The moisture-cure material offers fast tack-free performance at room temperature without requiring mixing or oven curing, helping support efficient assembly processes. Its thermally conductive formulation, controlled silicone volatility, and UL 94 V-0 flammability classification make it suitable for applications where thermal management and flame resistance are important considerations. The cured elastomer provides durable adhesion while maintaining electrical insulation properties.

Key features

  • Fast room-temperature cure: Tack-free in approximately 3 minutes with no mixing or oven curing required.
  • Thermal conductivity: Thermal conductivity of 0.84 W/m·K supports heat transfer from electronic components to thermal management systems.
  • Flame-resistant formulation: UL 94 V-0 classification and controlled silicone volatility support demanding electronic assembly environments.

Applications / Suitable for

  • Thermal management of electrical and electronic components
  • Bonding applications requiring heat dissipation
  • PCB system assemblies
  • Consumer electronic devices with compact designs
  • Applications requiring thermal transfer and added flame resistance
Product Family

DOWSIL SE 9184

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
White
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
One
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.2
Physical Properties
Tack-Free Time
3 minutes
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
60 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.84 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
20 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.5 x 10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the adhesive before cure and processing. Values are typical data and not intended as specifications.

Property Value Unit Method / condition
Product type One-part - As supplied
Color White - As supplied
Non-volatile content 98.9 % Typical value
Tack-free time 3 minutes 25°C
Physical form Paste - SDS appearance data
Technical properties

After-processing / final-state properties

Typical cured properties. Values are typical data and not intended as specifications.

Property Value Unit Method / condition
Thermal conductivity 0.84 W/m·K Typical cured property
Tensile strength 3.2 MPa Typical cured property
Elongation 60 % Typical cured property
Hardness 74 Shore A JIS standard
Lap shear adhesion to aluminum 1.7 MPa Unprimed adhesion
Dielectric strength 20 kV/mm Typical cured property
UL flammability classification 94 V-0 - UL classification

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