DOWSIL SE 4450

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL SE4450

Main features

  • 1.9 W/(m K) Thermal Bonding
  • Self-Leveling Flowable Placement
  • 6.7 MPa Aluminum Lap Shear

Product Description

DOWSIL™ SE 4450 Thermally Conductive Adhesive is a one-part, gray, heat-curable silicone adhesive formulated for bonding, sealing, and heat dissipation in electronics assemblies. It provides typical thermal conductivity of 1.9 W/m·K and combines self-leveling processing characteristics with high cured tensile strength. The material is suitable for electronic modules, semiconductor packaging, and printed circuit board assembly applications requiring both adhesive bonding and thermal transfer.

Key features

  • Thermally conductive: Provides typical thermal conductivity of 1.9 W/m·K for transferring heat through bonded electronic assemblies.
  • One-part heat cure: Requires no mixing of separate components and supports heat-accelerated curing.
  • Strong adhesive performance: Provides typical tensile strength of 6.7 MPa and aluminum lap-shear adhesion of approximately 3.5 MPa.

Applications / Suitable for

  • Electronic modules
  • Semiconductor and chip packaging
  • Printed circuit board assembly
  • Heat dissipation, sealing, bonding, and thermal-interface applications
Product Family

DOWSIL SE 4450

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
One Part
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.73
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
66000 mPa.s
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
46 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
22 kV/mm
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.92 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied and processing properties of DOWSIL SE 4450 Thermally Conductive Adhesive. Typical values are not intended for specification purposes.

Property Value Unit Method / condition
Number of components 1 part As supplied
Color Gray — As supplied
Specific gravity 2.7 — Typical value; test conditions not stated
Cure type Heat accelerated — Heat-cure adhesive
Heat-cure schedules 30 minutes at 125°C
15 minutes at 150°C		 — Reported cure options; actual part temperature and assembly conditions should be validated
Technical properties

After-processing / final-state properties

Typical cured properties of DOWSIL SE 4450 Thermally Conductive Adhesive. Typical values are not intended for specification purposes.

Property Value Unit Method / condition
Thermal conductivity 1.9 W/m·K Typical cured value; test method, temperature and specimen geometry not stated
Hardness 95 Shore A Typical cured value; test method and cure condition not stated
Tensile strength 6.7 MPa Typical cured value; test method and specimen preparation not stated
Elongation at break 46 % Typical cured value; test method and cure condition not stated
Unprimed lap-shear adhesion 3.45 MPa Aluminum lap-shear joint; detailed method, surface preparation, bondline and cure condition not stated

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