COOLTHERM MG-122

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

COOLTHERM MG-122

Main features

  • Single-Component No-Mix Dispensing
  • Thermally Conductive Chip Interface
  • Flip-Chip and BGA Application Fit

Product Description

CoolTherm MG-122 Thermally Conductive Gel is a one-component silicone thermal interface material for transferring heat from high-wattage electronic devices. The dispensable gel format avoids component mixing and is used around flip-chip microprocessors, PPGA, BGA, microBGA, DSP, and graphics accelerator devices. Its thermally conductive silicone composition supports interface filling where a soft gel is preferred over a rigid cured encapsulant. The product is supplied for controlled dispensing and stored under frozen conditions before use, supporting planned material conditioning in electronics assembly operations.

Key features

  • Single-component dispensing: The gel is applied without resin-to-hardener mixing.
  • Thermally conductive chip interface: The silicone gel supports heat transfer from high-wattage electronic components.
  • Package-level application fit: Applications include flip-chip, PPGA, BGA, microBGA, DSP, and graphics accelerator devices.

Applications / Suitable for

  • Flip-chip microprocessors
  • PPGA, BGA, and microBGA packages
  • DSP and graphics accelerator chips
  • High-wattage electronic components
Product Family

COOLTHERM MG-122

Loading pricing…
TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Gray Paste
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.57
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.8 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
8 x 10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

As-supplied characteristics for the one-component gel.

Property Value Unit Method / condition
Components One component No resin-to-hardener mixing step
Chemistry Silicone Thermally conductive gel
Physical form Dispensable gel Controlled application to electronic interfaces
Storage state Frozen Condition before use using the stated product procedure
Technical properties

After-processing / final-state properties

Installed-state characteristics for the soft thermal interface gel.

Property Value Unit Method / condition
Installed form Soft gel interface Non-structural thermal interface material
Primary function Heat-transfer interface High-wattage electronic devices
Interface behavior Conforms to package-level gaps Dispensable gel format
Device scope Flip-chip; PPGA; BGA; microBGA; DSP; graphics accelerators Applications

Leading Brands Trust in Our Products and Services

Products that Perform| Knowledge that Serves| Service that Delivers