COOLTHERM EP-6009
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 2,600 cP Mixed Viscosity
- 0.7 W/(m K) Thermal Encapsulation
- Electrically Insulating Encapsulation
Product Description
CoolTherm® EP-6009 Epoxy Encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance. The black mixed material combines a typical viscosity of 2,600 cP at 25°C with a 60-minute working life, supporting application through handheld cartridges or automatic meter/mix/dispense equipment. After cure, the system provides typical thermal conductivity of 0.7 W/m·K together with electrical insulation and rigid mechanical properties.
Key features
- Thermally conductive encapsulation: Provides a typical cured thermal conductivity of 0.7 W/m·K for potting applications requiring heat dissipation.
- Low mixed viscosity: The mixed system has a typical viscosity of 2,600 cP at 25°C to support dispensing and flow during encapsulation.
- Electrical insulation: Provides typical volume resistivity of 1.0 × 1015 ohm-cm at 25°C and dielectric strength of 500 V/mil after cure.
Applications / Suitable for
- Thermally conductive potting applications requiring flame retardance
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Resin: Black Liquid | Hardener: Amber Liquid | Mixed: Black Liquid
Appearance at room temperature.
Specific Gravity
Resin: 1.65 | Hardener: 1.00 | Mixed: 1.52
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity (Part A)
(Resin) 17500 mPa.s
Viscosity (Part B)
(Hardener) 40 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
75 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.7 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Dielectric Strength
0.5 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
1.0 x 10^15 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Mechanical Properties
Elongation
at break 1.9 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Chemical Properties
Moisture absorption
10 days @25°C 0.35 %
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties of the CoolTherm EP-6009 BLK resin, EP-6009 hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid / Amber liquid / Black liquid | — | EP-6009 BLK resin / EP-6009 hardener / mixed system |
| Viscosity | 17,500 / 40 / 2,600 | cP | EP-6009 BLK resin / EP-6009 hardener / mixed system at 25°C; test method not stated |
| Specific gravity | 1.65 / 1.00 / 1.52 | — | EP-6009 BLK resin / EP-6009 hardener / mixed system; test conditions not stated |
| Mix ratio by weight | 10:1 | Resin:hardener | CoolTherm EP-6009 BLK resin : CoolTherm EP-6009 hardener |
| Gel time | 28 | minutes | Mixed system at 65°C; test method not stated |
| Working life | 60 | minutes | Mixed system at 25°C; test method not stated |
| Cure time | 2–4 | hours | At 65°C after the material reaches the target temperature |
| Shelf life | 1 | year | Each component from date of manufacture when stored at 25°C in the original, unopened container |
Technical properties
After-processing / final-state properties
Typical cured properties of the CoolTherm EP-6009 BLK resin and EP-6009 hardener system. The documented cure schedule is 2–4 hours at 65°C after the material reaches the target temperature. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.7 | W/m·K | Test method not stated |
| Coefficient of linear thermal expansion | 47 | ppm/°C | Test method and temperature region not stated |
| Glass transition temperature | 75 | °C | TMA |
| Hardness | 90 | Shore D | Test method not stated |
| Tensile strength | 48.3 (7,000) | MPa (psi) | ASTM D638 |
| Elongation at break | 1.9 | % | ASTM D638 |
| Moisture absorption | 0.35 | % | 10 days at 25°C; exposure medium and test method not stated |
| Volume resistivity | 1.0 × 1015 | ohm-cm | ASTM D257 at 25°C |
| Dielectric strength | 500 | V/mil | Test method and specimen thickness not stated |
