COOLTHERM EP-2000
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 1.9 W/(m K) Thermal Encapsulation
- 1,900 cP Mixed Viscosity
- 204 deg C Glass Transition
Product Description
CoolTherm® EP-2000 Thermally Conductive Epoxy Encapsulant is a two-component, low-viscosity epoxy system developed for encapsulating motor stators, transformer coils, and other electrical devices with small-diameter, tightly packed windings. Its fine-particle-filled formulation combines a typical cured thermal conductivity of 1.9 W/m·K with high-temperature stability and electrical insulation. The black resin and white hardener mix at a 1:1 ratio by weight or volume to form a gray, self-leveling material suitable for manual or automated meter/mix/dispense processing.
Key features
- Thermally conductive encapsulation: Provides a typical cured thermal conductivity of 1.9 W/m·K.
- Low-viscosity, self-leveling system: The mixed material has a typical viscosity of 1,900 cP at 60 °C and a shear rate of 10/sec.
- High-temperature electrical insulation: Provides a typical glass transition temperature of 204 °C by DMA and volume resistivity of 1 × 1014 ohm-cm at 25 °C using ASTM D257.
Applications / Suitable for
- Motor stator and rotor encapsulation
- Transformer-coil encapsulation
- Electrical devices with small-diameter, tightly packed windings
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Resin: Black Liquid | Hardener: White Liquid | Mixed: Gray Liquid
Appearance at room temperature.
Specific Gravity
Resin: 2.72 | Hardener: 2.75 | Mixed: 2.73
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity (Part A)
@ 60°C 10/s 6080 mPa.s
Viscosity (Part B)
@ 60°C 10/s 1300 mPa.s
Young's modulus
by DMA 17500 MPa
Thermal Properties
Glass Transition Temperature (Tg)
by DMA 204 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
1.9 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Dielectric Strength
18.5 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
x 10^14 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties of the separate components and mixed encapsulant before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid / white liquid / gray liquid | — | Resin / hardener / mixed material |
| Mix ratio | 1:1 | By weight or volume | EP-2000 resin : EP-2000 hardener |
| Viscosity — resin | 6,080 | cP | At 60 °C; shear rate 10/sec |
| Viscosity — hardener | 1,300 | cP | At 60 °C; shear rate 10/sec |
| Viscosity — mixed | 1,900 | cP | At 60 °C; shear rate 10/sec |
| Specific gravity | 2.72 / 2.75 / 2.73 | — | Resin / hardener / mixed material at 25 °C |
| Gel time | 76 | minutes | Mixed material at 110 °C |
| Working life | >3 | hours | Mixed material at 60 °C |
Technical properties
After-processing / final-state properties
Typical cured properties after heating for 2 hours each at 120 °C, 150 °C, 180 °C, and 210 °C. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.9 | W/m·K | Cured bulk material; test method not stated |
| Coefficient of linear thermal expansion | 14.9 | ppm/°C | Cured material; test method and temperature region not stated |
| Glass transition temperature | 204 | °C | DMA |
| Hardness | 95 | Shore D | ASTM D2240 |
| Young’s modulus | 17.5 | GPa | DMA |
| Volume resistivity | 1 × 1014 | ohm-cm | ASTM D257 at 25 °C |
| Dielectric strength | 18.5 (470) | kV/mm (V/mil) | ASTM D149 |
