BERGQUIST SIL PAD TSP 1600S

Harmonization Code : 8547.90.00.00 | Insulating fittings for electrical machines, appliances or equipment, being fittings wholly of insulating material apart from any minor components of metal (for example, threaded sockets) incorporated during moulding solely for purposes of assembly, other than insulators of heading 8546; electrical conduit tubing and joints therefor, of base metal

BERGQUIST SIL PAD TSP 1600S

Main features

  • 0.61 deg C in^2/W Thermal Impedance
  • Electrical-Insulation Thermal Interface
  • Compliant Fiberglass-Reinforced Low-Pressure Thermal Pad

Product Description

BERGQUIST® SIL PAD® TSP 1600S is a fiberglass-reinforced, silicone-based thermal interface pad developed for electrically insulating heat transfer in low-pressure clamping applications. The pink, 0.229 mm thick material combines a smooth, compliant surface with a thermal conductivity of 1.6 W/m·K and a thermal impedance of 0.61 °C·in²/W at 50 psi, measured using ASTM D5470. It supports an operating temperature range of -60 to 180 °C and is available in sheet, roll, and die-cut formats, with or without pressure-sensitive adhesive.

Key features

  • Low-pressure thermal performance: Provides a typical thermal impedance of 0.61 °C·in²/W at 50 psi using ASTM D5470.
  • Electrical insulation: Delivers a typical dielectric breakdown voltage of 5,500 Vac using ASTM D149.
  • Flexible supply formats: Available as sheets, rolls, and die-cut parts, with or without pressure-sensitive adhesive.

Applications / Suitable for

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors
  • Discrete semiconductors mounted with spring clips under low clamping force
Product Family

BERGQUIST TSP 1600S

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Pink
Total Thickness
Total thickness is taking into account all the films, coatings, adhesives, release liners and special layers and is the maximum thickness of a film or tape.
229 μm
Thermal Properties
Operating Temperature
-60 to 180 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.6 W/m.K
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
20 %
Electrical Properties
Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity. It is the point at which a material ceases to be an insulator and becomes a resistor that  conducts electricity at some proportion of the total current.  After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material. This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.
5500 V
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1 x 10^10 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical construction and physical properties of the preformed thermal interface material before installation.

Property Value Unit Method / condition
Technology Silicone — Preformed thermal interface pad
Appearance Pink — Solid film
Reinforcement carrier Fiberglass — Product construction
Total thickness 0.229 mm ASTM D374
Density / relative density 1.5 — At 25 °C
Shore hardness 92 Shore A ASTM D2240
Tensile strength 9 MPa ASTM D412
Elongation 20 % ASTM D412; 45° to warp and fill
Technical properties

After-processing / final-state properties

Typical thermal and electrical properties of the installed pad. Thermal impedance and TO-220 performance depend on applied pressure and surface conditions.

Property Value Unit Method / condition
Thermal conductivity 1.6 W/(m·K) ASTM D5470
Thermal impedance 0.61 °C·in²/W ASTM D5470 at 50 psi; value includes interfacial thermal resistance
TO-220 thermal performance 2.9 °C/W At 50 psi
Dielectric breakdown voltage 5,500 Vac ASTM D149
Dielectric constant 6.0 — ASTM D150 at 1,000 Hz
Volume resistivity 1 × 1010 Ω·m ASTM D257
Operating temperature range -60 to 180 °C Retention of individual thermal, mechanical, and electrical properties across the full range is not stated
Flammability rating V-0 — UL 94

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