ABLESTIK SF 40
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Low-Density Syntactic Foam Adhesive
- Thixotropic Vertical-Surface Control
- Room-Temperature Adhesive Cure
Product Description
LOCTITE® ABLESTIK SF 40 is a two-component, non-conductive epoxy adhesive formulated as a lightweight, low-density syntactic foam. The thixotropic, non-sag system is suitable for bonding and repairing vertical surfaces where limiting added weight is important. It mixes at 100:9 by weight and can be cured at room temperature or with heat. Documented applications include aerospace and hydrospace assemblies, with ceramics, metals, and plastics identified as key substrates. The cured adhesive has a documented operating-temperature range of -40 to 120°C.
Key features
- Lightweight syntactic foam: Mixed density of 0.64 g/cm³ supports bonding and repair applications where added weight is a consideration.
- Non-sag, thixotropic consistency: Supports application to vertical surfaces while helping the mixed adhesive remain in place before cure.
- Flexible cure options: Cures in 48 to 72 hours at 25°C or in 2 to 4 hours at 65°C.
Applications / Suitable for
- Aerospace applications
- Hydrospace applications
- Repairing vertical surfaces with limited added weight
- Bonding ceramics, metals, and plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Density (g)
0.64 g/cm3
Mix Ratio
100 : 9
The amount of a constituent divided by the total amount of all other constituents in a mixture
Work life @25°C
0.5 hours
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
Thermal Properties
Glass Transition Temperature (Tg)
107 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
-40 to 120 °C
Chemical Properties
Water Absorption
2.0 %
Electrical Properties
Dielectric Strength
13.8 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
1×10¹² Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties of the individual components and mixed adhesive before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance — Part A | White paste | — | As supplied |
| Appearance — Part B | Amber liquid | — | As supplied |
| Mix ratio — Part A:Part B | 100:9 | by weight | Two-component system |
| Density — Part A | 0.61 | g/cm³ | ASTM D792 |
| Viscosity — Part B | 95 | mPa·s (cP) | Brookfield viscosity, ASTM D2393 |
| Density — Part B | 0.98 | g/cm³ | ASTM D792 |
| Density — mixed adhesive | 0.64 | g/cm³ | ASTM D792 |
| Work life | 30 | minutes | 100 g mixed quantity at 25°C |
| Shelf life | 365 | days | At 25°C |
| Cure schedule | 48–72 hours or 2–4 hours | — | 48–72 hours at 25°C or 2–4 hours at 65°C; guideline recommendations |
Technical properties
After-processing / final-state properties
Typical properties and performance data for the cured adhesive. Values are reference data rather than product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -40 to 120 | °C | Documented product range |
| Hardness | 70 | Shore D | ASTM D2240 |
| Water absorption | 2.0 | % | ASTM D570 |
| Coefficient of thermal expansion — below Tg | 33 | ppm/°C | ASTM D3386 |
| Coefficient of thermal expansion — above Tg | 107 | ppm/°C | ASTM D3386 |
| Glass-transition temperature | 107 | °C | ASTM D3418 |
| Dielectric strength | 13.8 | kV/mm | ASTM D149 |
| Dielectric constant / dissipation factor | 2.5 / 0.02 | — | ASTM D150 at 1 mHz, as reported |
| Volume resistivity at 25°C | 1 × 1012 | ohm-cm | ASTM D257 |
| Total mass loss | 0.23 | % | TML, ASTM E595 |
| Collected volatile condensable material | 0.04 | % | CVCM, ASTM E595 |
| Tensile lap shear strength — aluminum to aluminum | 14.5 (2,100) | N/mm² (psi) | Tested at 25°C |
| Tensile lap shear strength — aluminum to aluminum | 12.4 (1,800) | N/mm² (psi) | Tested at 65°C |
