ABLESTIK ICP9000

Harmonization Code : 3909.20.00.90 | Amino-resins, phenolic resins and polyurethanes, in primary forms : Melamine resins : Other

ABLESTIK ICP9000

Main features

  • Semi-Sintering Power Die Attach
  • Extended 16-Hour Work Life
  • Thermal and Electrical Attach Path

Product Description

LOCTITE ABLESTIK ICP 9000 is a one-part, silver-filled semi-sintering die-attach paste for high-power and high-temperature electronic devices. The electrically conductive material has a 16-hour work life and 2-hour open time at 25 deg C and uses a recommended conventional-oven cure of 1 hour at 200 deg C. The cured attach material has a typical thermal conductivity of 100 W/(m K) and volume resistivity of 7 x 10^-6 ohm cm. Guideline bondline thickness is 10 to 25 um for die up to 3 x 3 mm^2 and 20 to 50 um for larger die.

Key features

  • Semi-sintering silver attach: Forms an electrically conductive die-attach layer for power semiconductor assembly and solder-replacement evaluation.
  • Extended die-placement window: A 16-hour work life and 2-hour open time at 25 deg C provide a defined placement window.
  • Thermal and electrical conduction: The cured layer combines 100 W/(m K) thermal conductivity with 7 x 10^-6 ohm cm volume resistivity.

Applications

Applications include die attach for power IC, SiC, GaAs, and GaN devices and Sn/Pb or Au/Sn solder-replacement evaluation within the recommended process.

Product Family

ABLESTIK ICP9000

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver liquid
Filler Content
Silver %
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
16 hours
Physical Properties
Open time
120 minutes
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
5.5
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
11,500 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
25 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
100 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
7×10⁻⁰⁶ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Values apply to the one-part semi-sintering paste; die-size-specific ramp profiles and bondline guidance remain process-dependent.

PropertyValueUnitMethod / condition
AppearanceSilver liquidAs supplied
Filler typeSilverAs supplied
Thixotropic index5.50.5/5 rpm
Viscosity11,500mPa sBrookfield CP51; 25 deg C; 5 rpm
Work life16hours25 deg C
Open time2hours25 deg C
Shelf life365days-40 deg C; from date of manufacture
Conventional-oven cure1hour200 deg C; guideline recommendation
Technical properties

After-processing / final-state properties

Bulk properties and package-level results apply only to the stated cured material and test configurations.

PropertyValueUnitMethod / condition
Glass transition temperature25deg CTypical cured material
Coefficient of thermal expansion, below Tg25ppm/deg CTMA
Coefficient of thermal expansion, above Tg103ppm/deg CTMA
Thermal conductivity100W/(m K)Typical cured material
Volume resistivity7 x 10^-6ohm cmTypical cured material
In-package thermal resistance0.45K/W7 x 7 mm^2 QFN with 2.5 x 2.5 mm^2 Au BSM die; Ag or PPF substrate
Die shear strengthAg 10.9; Cu 10.8; PPF 10.0kg-f3 x 3 mm die; tested at 260 deg C

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