LOCTITE ABLESTIK CDF 625P

Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other

LOCTITE ABLESTIK CDF 625 LOCTITE ABLESTIK CDF 625 LOCTITE ABLESTIK CDF 625

Main features

  • Electrically conductive
  • Thermally conductive
  • Low warpage

Product Description

LOCTITE® ABLESTIK CDF 625P silver filled, die attach adhesive film is the most universal film, compatible with pre-cut wafer lamination equipment, recommended for large die applications. It is suitable for bonding integrated circuits and components with low warpage and good adhesion (>5MPA) on laminates and metal finishes. Furthermore, it has the lowest total cost of ownership and covers a wide die size range up to 10x10mm.

LOCTITE® ABLESTIK CDF 625P has a broad application space with controlled 25um bondline and a low modulus that is very close to Ablestik 8322A (2000 MPa @ RT, 40 MPa @ 250C.). This conductive die attach film can be effectively used for other applications and can also be a potentially replacement for QMI519.

Cure Schedule

  • 30 minute ramp to 100°C + 30 minutes @ 100°C +
  • 30 minute ramp to 175°C + 1 hour @ 175°C
Product Family

ABLESTIK CDF625P

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Product availability
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Packaging
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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
1440 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-5 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.008 Ohms⋅cm

Additional Information

How is CDF 625P packaged and "rolled?


Henkel has worked with its suppliers to improve the Conductive Die Attach Film (cDAF) product line by developing an edge tape layer to mitigate the occurrence of impression marks.
Two “Edge Tapes” are applied acting like a shim to reduce the contact pressure on the adhesive circles and potential impression marks on the roll. As these 2 “Edge Tapes” are applied outside of the functional CDF 625P adhesive circle, there’s no impact on Fit, Form, or Function! This makes this a major improvement without any effect to your current process.
 
 

CDF 600P - Die attach film property comparison

 

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