ABLESTIK 293-1
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Difficult-Substrate General Assembly Bonding
- 37.9 N/mm^2 Aluminum Lap Shear
- 3.20 x 10^14 ohm-cm Volume Resistivity
Product Description
LOCTITE® ABLESTIK 293-1 is a black, heat-cured epoxy adhesive developed for general assembly bonding. It is documented for bonding difficult-to-bond substrates and for use on gold, nickel, silver, and copper surfaces. The adhesive provides an eight-hour work life and multiple guideline cure schedules ranging from 24 hours at 60°C to 45 minutes at 120°C. Typical cured properties include thermal conductivity of 0.3 W/(m·K) at 121°C, volume resistivity of 3.20 × 1014 ohm-cm at 25°C, and aluminum-to-aluminum lap shear strength of 37.9 N/mm².
Key features
- Strong assembly bonding: Typical aluminum-to-aluminum lap shear strength is 37.9 N/mm².
- Electrical insulation: Typical cured volume resistivity is 3.20 × 1014 ohm-cm at 25°C, with dielectric strength of 900 V/mil.
- Flexible heat-cure options: Guideline schedules range from 24 hours at 60°C to 45 minutes at 120°C.
Applications / Suitable for
- General assembly bonding
- Bonding difficult-to-bond substrates
- Bonding gold, nickel, silver, and copper surfaces
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Black
Appearance at room temperature.
Chemistry Type
Epoxy
Work life @25°C
8 hours
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
Thermal Properties
Glass Transition Temperature (Tg)
98 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.3 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Volume Resistivity
3.20×10¹⁴ Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical appearance, handling, storage, and guideline cure information before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Heat-cured assembly adhesive |
| Appearance | Black paste / liquid | — | TDS appearance and SDS physical-state description |
| Density / relative density | 1.2 | — | SDS physical-property value |
| VOC content | 7 | g/L | SDS value |
| Work life | 8 | hours | Temperature and endpoint not stated |
| Shelf life — premixed frozen | 365 | days | At -40°C |
| Recommended cure schedule | 24 | hours | At 60°C; guideline recommendation |
| Alternative cure schedules | 4 hours, 90 minutes, or 45 minutes | — | 4 hours at 75°C, 90 minutes at 95°C, or 45 minutes at 120°C; guideline recommendations |
Technical properties
After-processing / final-state properties
Typical cured physical, thermal, electrical, and bonded-joint properties. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 85 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 98.0 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion — below Tg | 75.0 | ppm/°C | Test method and cure condition not stated |
| Coefficient of thermal expansion — above Tg | 150 | ppm/°C | Test method and cure condition not stated |
| Thermal conductivity | 0.3 | W/(m·K) | At 121°C; test method, specimen geometry, and cure condition not stated |
| Volume resistivity | 3.20 × 1014 | ohm-cm | At 25°C; test method, specimen geometry, and cure condition not stated |
| Dielectric strength | 900 | V/mil | Test method, thickness, conditioning, and cure condition not stated |
| Dielectric constant | 4.0 | — | At 1 kHz |
| Dissipation factor | 0.015 | — | At 1 kHz |
| Lap shear strength — aluminum to aluminum | 37.9 (5,500) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — gold to gold | 27.6 (4,000) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — brass to brass | 27.6 (4,000) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — silver to silver | 26.2 (3,800) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
