LOCTITE ABLESTIK 12-1

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE ABLESTIK 12-1

Main features

  • Thermally Conductive Bonding
  • Reworkable Bonding Material
  • Up to 200 deg C Service

Product Description

LOCTITE ABLESTIK 12-1 is a one-part, heat-cure silicone adhesive designed for general assembly bonding at operating temperatures up to 200°C. Supplied as an off-white, unfilled paste, it cures via a heat-activated schedule and offers approximately seven times the thermal conductivity of unfilled silicone adhesives. The adhesive is reworkable after cure, supporting rework or rework-sensitive assembly processes. It is packaged in metal squeeze tubes for dispensing and is intended for applications where thermal management and temperature-resistant bonding are required, with a primer recommended for improved adhesion on certain substrates.

Key features

  • Thermally conductive: Roughly seven times the thermal conductivity of unfilled silicone adhesives.
  • Reworkable: Cured bonds can be reworked, supporting rework and rework-sensitive assembly.
  • High-temperature capability: Rated for continuous operating temperatures up to 200°C.

Applications / Suitable for: General assembly bonding where heat resistance and thermal conductivity are required.

Product Family

ABLESTIK 12-1

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Off - White
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
12 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.3 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1000000000000000 Ohms⋅cm

Additional Information

Technical properties

After-processing / final-state properties

Typical properties of the fully cured material after the recommended cure schedule.

Property Value Unit Method / condition
Hardness 90 Shore A Cured material
Glass transition temperature (Tg) 12 °C By TMA
Coefficient of thermal expansion, below Tg 55 ppm/°C TMA
Coefficient of thermal expansion, above Tg 150 ppm/°C TMA
Thermal conductivity 1.3 W/(m·K) @ 121°C
Volume resistivity 1×10¹⁴ ohm·cm Cured material
Lap shear strength 2.07 (300) N/mm² (psi) Aluminum-to-aluminum, 25°C

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