3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2

Main features

  • Preformed Epoxy Film
  • Multiple Product Configurations
  • Vacuum Curing Capability

Product Description

3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 is a thermosetting modified epoxy structural adhesive film available in multiple weights and supported or unsupported constructions. It is intended for structural bonding in solid-panel and honeycomb sandwich assemblies. The film combines high fracture toughness and peel strength with bond performance across temperatures from -67°F to 250°F (-55°C to 121°C). It can be processed using positive-pressure or controlled vacuum-curing methods and is available with knit, non-woven, fiberglass-scrim, one-side-tacky, and unsupported constructions to accommodate different assembly requirements.

Key features

  • Structural epoxy film: Thermosetting modified epoxy chemistry provides a controlled, preformed adhesive layer for structural bonding.
  • Broad construction selection: Available in multiple nominal weights, thicknesses, colors, and carrier configurations, including unsupported film.
  • Flexible cure processing: Supports positive-pressure bonding and controlled vacuum-curing techniques, with documented short cure schedules from 225°F to 300°F.

Applications / Suitable for

  • Solid-panel structural bonding
  • Honeycomb sandwich constructions
  • Metal-to-metal structural assemblies
  • Metal-to-honeycomb structural assemblies
Product Family

3M AF 163-2

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TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
108 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.66 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
70.9 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
4.4 x 10^14 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Available constructions and dimensions vary by AF 163-2 product designation. Values are nominal unless otherwise stated.

Property Value Unit Method / condition
Product form Structural adhesive film — As supplied
Adhesive chemistry Thermosetting modified epoxy — Product family description
Available constructions Fiberglass scrim, knit carrier, light non-woven carrier, non-woven carrier, one-side-tacky non-woven carrier, or unsupported — Varies by product designation
Available nominal film weights 0.015, 0.030, 0.045, 0.060, 0.085, or 0.100 lb/ft² Nominal; availability depends on construction
Available nominal thicknesses 2.5, 5.5, 7.5, 9.5, 13, or 16 mil Nominal; availability depends on construction and film weight
Recommended storage temperature 0 or below °F Recommended for maximum storage life
Shelf life 12 months From date of shipment in the original unopened container at 0°F or below

 

Technical properties

After-processing / final-state properties

Typical cured-film properties are representative laboratory values and are not intended for specification purposes. Cure and test conditions are preserved below.

Property Value Unit Method / condition
Ultimate tensile strength 7,000 psi ASTM D638; unsupported free film; tested at 75°F; cured 60 minutes at 250°F
Tensile modulus 1.6 × 105 psi ASTM D638; unsupported free film; tested at 75°F; cured 60 minutes at 250°F
Glass-transition temperature, dry 226 (108) °F (°C) DuPont 1090 DMA; 5°C/min ramp; cured 90 minutes at 235°F
Glass-transition temperature, wet 180 (82) °F (°C) DuPont 1090 DMA; after 14 days in 70°C water; 5°C/min ramp; cured 90 minutes at 235°F
Thermal conductivity at 43°C 0.096 Btu·ft/(ft²·hr·°F) ASTM C177; cured 90 minutes at 235°F
Coefficient of thermal expansion 90 × 10-6 in/in/°C TMA; -30°C to 50°C; 5°C/min; cured 90 minutes at 235°F
Volume resistivity 4.4 × 1014 ohm·cm ASTM D257; cured 90 minutes at 235°F
Dielectric strength 1,800 V/mil ASTM D149; 1 kHz at 75°F (23°C); cured 90 minutes at 235°F

 

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